Ah, okay, what I am actually trying to find out is what makes FR4 act worse
than e.g. teflon at data rates beyond 2,5 Gbps. Is it the loss tangent or
the epsilon r? How is the frequency-dependent attenuation physically
describable? Where does the energy go? Heat, ...? It was my opinion that
higher frequencies can be transmitted over coax but not over FR4 because of
the geometry. Because in a coax there is (almost) no energy loss because the
TEM wave is "captured" by the outer shield and in a planar setup like
stripline or microstrip there are E-field and H-field lines vanish into the
air environment (or somewhere else...). Therefore I'm trying to design a
coax on a PCB. Am I right with my thoughts, anyway?
A couple of things make pcb's lossy: the loss tangent of the material
(and FR4 is pretty bad) and the copper losses. Copper loss gets bad on
conventional FR4 boards because
1. FR4's Er is high, so for a given impedance traces are skinny.
2. The underside of the copper is treated to bond to the epoxy/glass,
and the treatment (black oxide or something) greatly increases skin
losses. Peel some up and look... it's gross.
3. In the case of microstrip, the current is concentrated on the
underside (the dirty side) of the trace, so losses are that much
worse... the shiny topside of the copper is underutilized. Stripline
would be better, with balanced current density, except that the trace
will be much thinner, which has its own penalty.
A good microwave pcb has a low Er, low loss dielectric; is thick, for
low current density and wide traces; has very smooth copper, which
means traces and pads peel off easily.
I don't think any simple geometry tricks (ie, emulating coax) will
make FR4 any better, and would probably make it worse. For low losses,
microstrip on a thick board is probably as good as it gets.
John